ISO/TS 10303-1754:2010-03 Via component


Application module: Via component	ISO/TS 10303-1754:2010-03(E) © ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations

4 Information requirements
4.1 Required AM ARMs
4.2 ARM entity definitions
4.3 ARM subtype constraint definition
5 Module interpreted model
5.1 Mapping specification
5.2 MIM EXPRESS short listing
5.2.1 MIM entity definitions
5.2.2 MIM subtype constraint definition

A MIM short names
B Information object registration
C ARM EXPRESS-G
D MIM EXPRESS-G
E Computer interpretable listings
Bibliography
Index

Index

Blind_via

ARM object definition 4.2.1

ARM EXPRESS-G C.2

mapping specification 5.1.1

blind_via

MIM object definition 5.2.1.1

MIM EXPRESS-G D.2

Buried_via

ARM object definition 4.2.2

ARM EXPRESS-G C.2

mapping specification 5.1.2

buried_via

MIM object definition 5.2.1.2

MIM EXPRESS-G D.2

Interconnect_module_connection_routing_arm

ARM interface 4.1

Interconnect_module_connection_routing_mim

MIM interface 5.2

Interfacial_connection

ARM object definition 4.2.3

ARM EXPRESS-G C.2

mapping specification 5.1.3

interfacial_connection

MIM object definition 5.2.1.3

MIM EXPRESS-G D.2

Layered_interconnect_module_design_arm

ARM interface 4.1

Layered_interconnect_module_design_mim

MIM interface 5.2

Non_conductive_base_blind_via

ARM object definition 4.2.4

ARM EXPRESS-G C.2

mapping specification 5.1.4

non_conductive_base_blind_via

MIM object definition 5.2.1.4

MIM EXPRESS-G D.2

Plated_conductive_base_blind_via

ARM object definition 4.2.5

ARM EXPRESS-G C.2

mapping specification 5.1.5

plated_conductive_base_blind_via

MIM object definition 5.2.1.5

MIM EXPRESS-G D.2

via_subtypes

ARM object definition 4.3.1

ARM EXPRESS-G C.2

via_subtypes

MIM object definition 5.2.2.1

MIM EXPRESS-G D.2

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