Industrial automation systems and integration —
Product data representation and exchange —
Part 1754:
Application module: Via component

1 Scope

This part of ISO 10303 specifies the application module Via component. The following are within the scope of this part of ISO 10303:

• blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
• cylinder vias, where the cross-section shape is constant;
• tapered vias, where the cross-section shape may vary as the vertical distance changes;
• stacked vias, where multiple bind and buried vias share the same x y position;
• filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
• buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
• interfacial connections, also known as through hole vias, which have both ends exposed;
• items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
• items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.

The following are outside the scope of this part of ISO 10303:

• Stratum features;
• Cutouts.

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