ISO/TS 10303-1754:2010-03 Via component


Application module: Via component	ISO/TS 10303-1754:2010-03(E) © ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations

4 Information requirements
4.1 Required AM ARMs
4.2 ARM entity definitions
4.3 ARM subtype constraint definition
5 Module interpreted model
5.1 Mapping specification
5.2 MIM EXPRESS short listing
5.2.1 MIM entity definitions
5.2.2 MIM subtype constraint definition

A MIM short names
B Information object registration
C ARM EXPRESS-G
D MIM EXPRESS-G
E Computer interpretable listings
Bibliography
Index


         (*
ISO TC184/SC4/WG12 N6556 - ISO/TS 10303-1754 Via component - EXPRESS MIM
Supersedes 
         ISO TC184/SC4/WG12 N5822
*)



SCHEMA Via_component_mim;


         USE FROM
         Interconnect_module_connection_routing_mim;
            -- ISO/TS 10303-1684


         USE FROM
         Layered_interconnect_module_design_mim;
            -- ISO/TS 10303-1698


ENTITY blind_via

           ABSTRACT SUPERTYPE
         
         OF (ONEOF (non_conductive_base_blind_via,
                                plated_conductive_base_blind_via))

           SUBTYPE OF (via);

         
         END_ENTITY;


ENTITY buried_via

           SUBTYPE OF (via);

         
         END_ENTITY;


ENTITY interfacial_connection

           SUBTYPE OF (via);

         
         END_ENTITY;


ENTITY non_conductive_base_blind_via

           SUBTYPE OF (blind_via);

         
         END_ENTITY;


ENTITY plated_conductive_base_blind_via

           SUBTYPE OF (blind_via);

         
         END_ENTITY;


SUBTYPE_CONSTRAINT via_subtypes FOR via;

           ONEOF (blind_via,
         buried_via,
         interfacial_connection);
      
         END_SUBTYPE_CONSTRAINT;



         END_SCHEMA;  -- Via_component_mim