| Application module: Via component | ISO/TS 10303-1754:2010-03(E) © ISO | 
         (*
ISO TC184/SC4/WG12 N6555 - ISO/TS 10303-1754 Via component - EXPRESS ARM
Supersedes 
         ISO TC184/SC4/WG12 N5821
*)
         
SCHEMA Via_component_arm;
         USE FROM
         Interconnect_module_connection_routing_arm;
            -- ISO/TS 10303-1684
         USE FROM
         Layered_interconnect_module_design_arm;
            -- ISO/TS 10303-1698
ENTITY Blind_via
           ABSTRACT SUPERTYPE
         
         OF (ONEOF (Non_conductive_base_blind_via,
                                Plated_conductive_base_blind_via))
           SUBTYPE OF (Via);
         
         END_ENTITY;
ENTITY Buried_via
           SUBTYPE OF (Via);
         
         END_ENTITY;
ENTITY Interfacial_connection
           SUBTYPE OF (Via);
         
         END_ENTITY;
ENTITY Non_conductive_base_blind_via
           SUBTYPE OF (Blind_via);
         
         END_ENTITY;
ENTITY Plated_conductive_base_blind_via
           SUBTYPE OF (Blind_via);
         
         END_ENTITY;
SUBTYPE_CONSTRAINT via_subtypes FOR Via;
           ONEOF (Blind_via,
         Buried_via,
         Interfacial_connection);
      
         END_SUBTYPE_CONSTRAINT;
         END_SCHEMA;  -- Via_component_arm
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