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            | Application module:
                  
                  Sequential laminate assembly design | ISO/TS 10303-1741:2018-11(E) © ISO
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            | TECHNICAL SPECIFICATION | ISO/TS 10303-1741:2018-11(E) | 
      
      
      
         Industrial automation systems and integration — 
         Product data representation and exchange —  
         Part 1741:
         Application module: 
         Sequential laminate assembly design
      
      
      
         This part of ISO 10303 specifies the application module
         Sequential laminate assembly design.
         
         The following are within the scope of this part of ISO 10303: 
         
      
      
         - sequence of application of an embedded component;
- sequence of material buildup or lamination;
- support for embedded component location;
- items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
         
         The following are outside the scope of this part of ISO 10303: 
         
      
      
            
         - detailed process description of how to create a via;
- detailed process description of how to create the bond between multiple laminate components;
- detailed process description of how to embed components in a substrate.
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