AP210: Electronic Assembly,Interconnect and Packaging Design
Technology
Physical
Component Placement
Bare Board Geometry
Layout items
Layers non-planar,
conductive & non-conductive
Material product
Geometrically Bounded 2-D
Wireframe with Topology
Surfaces
Advanced BREP Solids
Constructive Solid Geometry
Part
Functionality
Termination
Shape 2D, 3D
Single Level Decomposition
Material Product
Characteristics
Configuration Mgmt
Identification
Authority
Effectivity
Control
Requirement Traceability
Analytical Model
Document References
Product Structure/
Connectivity
Functional
Packaged
Fabrication Design Rules
Product Design Rules
Requirements
Design
Allocation
Constraints
Interface
Rules
Geometric Dimensioning and Tolerancing
Geometry
Design Control
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