|AP 210e2: Electronic Assembly, Interconnection, and Packaging Design||[www.steptools.com] [ST-Developer Home] [Installed Schemas]|
EXPRESS source and associated files for STEP Part 210: Application Protocol For Electronic Assembly, Interconnection, and Packaging Design. The standard was published in 2001 and replaced by a second edition published in 2011 as ISO 10303-210:2010(E).
Programming LibrariesFor C++ programming, the ap210lib class library is pre-installed and provides AP210-specific classes for use with the ST-Developer ROSE programming library
For Java programming, the ap210lib jar file is pre-installed and provides AP210-specific classes for use with the ST-Developer Java programming library