| AP 210e2: Electronic Assembly, Interconnection, and Packaging Design | [Installed Schemas] [ST-Developer Home] [www.steptools.com] |
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OverviewEXPRESS source and associated files for STEP Part 210: Application Protocol For Electronic Assembly, Interconnection, and Packaging Design. The standard was published in 2001 and will be replaced by a second edition to be published in 2010 as ISO 10303-210:2010(E).
The first edition and latest version of the standard are available on the ISO web site as well as through national standards bodies. Programming LibrariesFor C++ programming, the ap210lib class library is pre-installed and provides AP210-specific classes for use with the ST-Developer ROSE programming library
For Java programming, the ap210lib jar file is pre-installed and provides AP210-specific classes for use with the ST-Developer Java programming library
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