SCOPE & USES OF AP210:ELECTRONIC ASSEMBLY INTERCONNECT AND PACKAGING DESIGN
SCOPE: CONFIGURATION CONTROLLED DESIGN CAPTURE OF ELECTRICAL OR ELECTRONIC ASSEMBLIES, INTERCONNECTION, PACKAGING, AND ASSOCIATED LIBRARY DATA
- SEPARATE MODEL OF THE ASSEMBLY AND THE INTERCONNECT
- SUPPORTS THERMAL, STRUCTURAL, AND OTHER PHYSICAL ANALYTICAL METHODS; 2D & 3D
- DESIGN VIEW AND USAGE VIEW
- PARTS MODELING CAPABILITY